Temperatures and thermography
The curves show a periodic load pattern with clear ups and downs for the AI image generation run. The GPU fluctuates between around 53 and 66 degrees Celsius, while the memory modules are several Kelvin higher and reach peaks of around 72 to 73 degrees Celsius during the longer load phases. The sequence of load peak, brief relief and renewed increase indicates inference cores that are processed in blocks, in which memory accesses and compute shares alternate. The constantly larger spread between memory and GPU is noticeable, which is typical for image generation because the attention blocks force high VRAM throughputs. A heat build-up is not recognizable, the temperatures drop quickly to the mid-50 degrees in the idle intervals, the control works stably without thermal build-up.
For the thermal analysis of the Intel Arc Pro B50, my Optris PI640 was used, which works with a resolution of 640 × 480 pixels and high temperature precision. This allows hotspots and temperature distributions on the board to be documented very reliably. Tests were carried out under idle conditions as well as under typical load in AI and memory workloads. In the first image (IR idle), the card shows a homogeneous temperature pattern at room temperature. The GPU socket is at around 50.7 °C, the VRM ranges are between 47 and 49 °C. The hotspot on the back is shown at 55 °C, the memory chips are around 52 to 53 °C. Even in idle mode, it can be seen that the card has an evenly heated temperature field without any noticeable peaks.
GPU load (AI workload)
Under full load (IR GPU load), the temperatures rise significantly as expected. The hotspot reaches almost 70 °C, the GPU socket around 64 °C. The VRM VDDC is recorded at 67.3 °C, the MVDD rail at 54 °C. The memory chips in particular heat up significantly; values between 61 and 64 °C are typical. The image shows that heat dissipation is consistent in all areas and no local overheating occurs.
Storage load
With a memory-heavy workload (IR memory load), the hotspots shift more strongly to the area of the VRAM components. Peaks of up to 68.5 °C are measured here, with the hotspot rising to around 71 °C. GPU sockets and VRMs remain in the range between 63 and 64 °C. This clearly shows that the load on the memory has a greater influence on the thermal limit range than pure compute load.
The measurement results show an overall non-critical thermal behavior. With a maximum of around 70 to 71 °C under the heaviest load scenarios, the card remains far away from critical thresholds. It is only noticeable that the memory modules operate slightly warmer than the GPU itself in relative terms. Since Intel relies on simple aluminum heatspreaders with pads, this behavior is technically understandable. The VRMs also remain in the safe range at just over 65 °C. The thermography with the PI640 proves that the Arc Pro B50 is thermally balanced in its overall design and that there are no invisible hotspots on the back of the PCB that could become critical in normal operation.
Clock rates
At the beginning, the clock rates are on a high plateau and move briefly in the range just above 2.5 GHz, after which recurring steps between around 2.2 and 2.4 GHz are seen. In the later cycles, plateaus around 1.9 to 2.0 GHz can be seen, with occasional short drops towards 1.7 to 1.8 GHz before the clock picks up again in the next cycle. The pattern follows the power limit, not the temperature. The GPU temperature fluctuates within a moderate window, while the clock rates correspond exactly with the load blocks. This suggests a power-controlled boost behavior with transient upper limits, in which the card makes full use of the available slot frame and dynamically adjusts the frequency to the power budget.
Fan control
The fan curve shows clearly graduated plateaus. During load peaks, the speed rises to around 2600 to 2700 rpm, while it falls back to around 2000 rpm in the off-load phases. The GPU temperature follows the fan control with a slight delay, which indicates a conservatively designed, but not overly aggressive characteristic curve. The control avoids high amplitudes and reliably keeps the GPU below around 66 degrees, while the memory peaks are recaptured with the slightly delayed fan jumps. From an acoustic point of view, a cyclical but predictable volume characteristic can be expected.
Power consumption and slot limit
The power consumption curve compares three workloads. In AI image generation, the card stabilizes at around 68 to 70 watts in the load phases, with short transients above this. Blender shows stronger fidgeting peaks that reach into the upper 60 watt range, but drop off more frequently. The AutoCAD Mixed workload is significantly lower and remains stable at around 40 to 42 watts.
The frame of the PCIe slot is important. A standard 5.5 amps are available for 12 volts, i.e. 66 watts. The observed plateaus of around 69 to 70 watts can be explained by the fact that there is also a small load on the 3.3 volt rail. This rail is specified in the slot and can provide a few watts. If a small 3.3-volt power is added to the 12-volt 66 watts, the measured plateaus are plausible without violating the 12-volt specification. The clock levels in the later cycles match this finding, the card regulates the boost in such a way that the combined slot budget is adhered to. The fact that no temperature-driven throttling is visible underlines the fact that the limiting factor in this scenario is the slot’s power budget and not the cooling.
To summarize: the Arc Pro B50 is again severely power-limited under full GPU load. However, the temperatures remain conservative, the fan control is graduated and stable, the clock rate follows the power limit in easily recognizable steps. The short overshoots in power consumption can be explained by the combined use of the 12-volt slot and low 3.3-volt load; the 66-watt limit of the 12-volt line is largely adhered to.
- 1 - Introduction, unboxing and technical data
- 2 - Test system and equipment
- 3 - Teardown: PCB, topology and components
- 4 - Teardown: Cooling solution
- 5 - Teardown: Material analysis and ASTM TIM testing
- 6 - Autodesk AutoCAD
- 7 - Autodesk Inventor Pro
- 8 - PTC Creo
- 9 - Dassault Systèmes Solidworks
- 10 - Autodesk Maya
- 11 - SPECviewperf 15 (2025)
- 12 - Adobe Photoshop 26.10
- 13 - Adobe After Effects 2025
- 14 - Adobe Premiere Pro 25.41
- 15 - AI Benchmarks (AI Vision, Image, Text)
- 16 - Rendering
- 17 - Temperatues, clock rates, power draw and fan speed
- 18 - Summary and conclusion










































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