MSI GeForce RTX 5070 Ti Vanguard SOC review – What can the RTX 5080’s smaller sister, which only has a different chip, do?

1 - Introduction, overview and technical data 2 - Test system and equipment 3 - Teardown: PCB and cooler 4 - Teardown: Material analysis and thermal interface materials 5 - Gaming Performance: Rasterization 6 - Gaming Performance: Supersampling, RT and FG 7 - Power consumption, load peaks, PSU recommendation 8 - Temperatures, clock rates and thermography 9 - Fan curves and operating noise 10 - Summary and conclusion

I will now also cover the thermal management materials of the MSI GeForce RTX 5070 Ti Vanguard SOC and it is no secret that they are identical to those used on the previously tested RTX 5080 Vanguard SOC and SUPRIM. I had already measured them all with my TIMA5 nanotest. However, this procedure is probably unique in its precision and depth of detail, as the TIMA5 enables a precise analysis of the thermal properties and thus allows a differentiated evaluation of the thermal pads used and the other thermal interface materials.

These measurements go beyond conventional tests and provide detailed insights into the efficiency of heat transfer, which is of central importance for a card of this performance class. The results will not only evaluate the performance of the materials themselves, but will also show their influence on the overall cooling of the card and possible optimization potential. This is precisely why I am including this again at this point. After all, nothing has changed.

Phase Transition Pad Honeywell PTM 7950

Since I only found remnants on the GPU, I am using my own measurement of an unused pad from my archive here, as I will be using it again during assembly. With over 6.3 W/mK, this durable pad is a better solution than almost all available pastes.

The thermal pads on the memory modules

The thermal pad used, with a thermal conductivity of 9.12 W/mK, stands out due to its exceptional performance and consistency. It differs from conventional pads in its dry, almost rolled texture, which is reminiscent of a compacted thermal putty. This material offers some decisive advantages that not only influence the thermal efficiency, but also the mechanical load on the card. The dry and at the same time flexible consistency of the pad enables optimum adaptation to the uneven surfaces of the components and the cooler. This adaptability achieves a maximum contact surface, which significantly improves heat transfer. At the same time, the material structure reduces the pressure exerted on sensitive components such as VRAM modules or voltage converters. This significantly reduces the risk of mechanical damage or stress cracks.

The fact that the pad is good and well-fitting can also be seen from the almost linear curve, where the thermal resistance also behaves perfectly with increasing pressure and lower layer thickness. Another advantage of the material is its stability. In contrast to conventional, softer pads, which often tend to “bleed” or “oil out” – i.e. the release of liquid components under pressure or heat – this pad remains dimensionally stable and retains its thermal properties even under long-term stress. This not only increases the service life of the pad itself, but also the stability of the entire thermal solution. The material analysis shows that, similar to thermal conductive pastes, aluminum and zinc oxide as well as a silicone-based matrix are used.

The remaining heat conducting pads (VRM, coils, other active components)

The other thermal conductive pads used, with a thermal conductivity of only 3.3 W/mK, tend to belong to the lower middle class and only meet basic heat transfer requirements. The silicone-free matrix used in these thermal pads is based on special polymers that represent an alternative to conventional silicone-based materials. Such polymers offer several advantages, but also specific challenges when used as a heat conducting material.

Compared to silicone, silicone-free polymers are characterized by greater stability under thermal and mechanical stress. They are less likely to bleed or dry out under pressure or heat, resulting in a longer pad life and more consistent thermal performance. This is particularly important in applications such as graphics cards, where consistent heat transfer and material stability over an extended period of time are critical. Despite these advantages, silicone-free pads are often softer and less dimensionally stable, which reduces their mechanical resilience. They can deform under pressure and thus impair their thermal performance, especially if the pads are applied thinly or unevenly. This deformation is illustrated in the pads described here by the sharp drop in the performance data curve under pressure.

Silicone-free polymers are therefore an interesting solution for thermal pads, as they offer chemical stability and long-term reliability. However, their use requires careful adaptation to the specific requirements, especially when it comes to pressure distribution and mechanical resilience. Optimizations in the material composition could minimize these weaknesses and bring out the advantages even better.

Analysis of vapor-chamber and aluminum carrier frames

The large vapor chamber of the MSI GeForce RTX 5070 Ti Vanguard SOC is made of pure electrolysis copper and is a central element of the cooling concept and has a nickel coating. This design offers several technical advantages that improve both the efficiency of heat dissipation and the longevity of the components. The nickel coating of the vapor chamber offers additional advantages. Nickel is not only corrosion-resistant, but also protects the chamber’s sensitive copper surfaces from oxidation.

This protective coating is particularly important in environments with high humidity or aggressive chemical conditions, as it ensures the long-term stability and performance of the chamber. In addition, nickel improves the mechanical stability of the surface, which increases the durability of the entire cooling structure. Another advantage of nickel coating is its compatibility with modern thermal pastes and pads. Some materials, especially those with metal particles, can react chemically with uncoated copper. The nickel coating prevents such reactions and ensures that the thermal properties remain constant over the entire service life.

Now let’s take a look at the structural framework of the cooler. The frame is made of an aluminum-magnesium alloy, which is characterized by a balanced combination of high strength, low weight and thermal stability. These material properties make it particularly suitable for high-performance applications such as graphics cards, where both mechanical stability and effective heat dissipation are required. A key advantage of this alloy is its high strength combined with low mass. This reduces the overall weight of the frame, which is particularly important in compact electronic devices in order to minimize mechanical stress on circuit boards and plug connections. At the same time, the high stability ensures that the frame retains its shape even under high loads, for example due to heavy heat sinks or uneven pressure distribution.

In terms of heat dissipation, the aluminum-magnesium alloy offers good thermal conductivity, which is lower than that of pure aluminum but sufficient for most applications. As a result, heat can be effectively dissipated from critical components such as voltage converters. The thermal stability of the alloy also ensures that the frame retains its shape even during temperature changes, which is an advantage for components with tight tolerances. The material is also characterized by high corrosion resistance, especially if it has been further protected by nickel plating, as in this case. This coating protects the frame from oxidation and mechanical wear, even under demanding environmental conditions such as high humidity or heavy dust exposure.

That concludes this part of the process and we can now play another round. Turn the page please!