Phase Transition Pad Honeywell PTM 7950
I will now also analyze the thermal conduction materials of the MSI GeForce RTX 5070 Ti Gaming Trio and it is pleasing that quality is now important, which is also shown by the use of a phase transition pad instead of cheaper thermal paste. The Honeywell PTM 7950 is a durable thermal pad based on phase transition materials. It remains solid at room temperature and becomes liquid once at operating temperatures, optimally filling the gaps between the GPU and the cooling device.
This enables improved heat transfer by minimizing thermal resistance. The material is often used in high-end graphics cards to ensure constant cooling performance and efficient dissipation of the heat generated by the GPU. The fact that this is also the case with the MSRP card should be praised.
At over 6.3 W/mK, this durable and silicon-free pad is a better solution than almost all available pastes.
Since I only found remnants on the GPU, I’m using my own measurement of an unused, identical pad from my archive, as I’ll be putting it back on during assembly.
The thermal pads on the memory modules
The assembly corresponds to the RTX 5080 Vanguard already tested. The thermal pad with 9.12 W/mK is characterized by its dry, compacted structure, which is reminiscent of thermal putty. This consistency maximizes the contact surface, improves heat transfer and reduces mechanical stress on sensitive components such as VRAM and voltage converters. This significantly reduces the risk of damage or stress cracks.
The almost linear curve of the thermal resistance shows the high fitting accuracy of the pad, which also behaves optimally with increasing pressure and decreasing layer thickness. Another advantage is its dimensional stability: unlike softer pads, which release liquids under heat and pressure, this material remains stable and retains its thermal properties over the long term. The analysis confirms a composition of aluminum and zinc oxide in a silicone-based matrix, similar to high-quality thermal conductive pastes.
The remaining thermal pads (VRM, coils, other active components)
The 3.3 W/mK thermal pads used belong to the lower middle class and only meet basic requirements. Although their silicone-free polymer matrix offers advantages such as greater stability and less bleeding under heat and pressure, they are softer and less dimensionally stable. This can lead to deformations that impair heat transfer, which is reflected in the sharp drop in the performance data curve under pressure.
Silicone-free polymers are therefore an interesting solution for thermal pads, as they offer chemical stability and long-term reliability. However, their use requires careful adaptation to the specific requirements, especially when it comes to pressure distribution and mechanical resilience. Optimizations in the material composition could minimize these weaknesses and bring out the advantages even better.
Analysis of heatsink, heatpipes and cooler
The GPU’s heatsink is made of pure electrolytic copper and is a central element of the cooling concept. A nickel coating protects the surface from oxidation and increases corrosion resistance, which improves both heat dissipation and durability. The memory modules and voltage converters are also connected to this heatsink.
The rest of the construction is made of simple aluminum.
That concludes this part and we’ll play another round. Turn the page please!
- 1 - Einführung und Details zur Blackwell GB203-300-A1 GPU
- 2 - Testsystem und Equipment
- 3 - Teardown: Platine und Kühler
- 4 - Materialanalyse und Wärmeleitmaterialien
- 5 - Gaming Performance; Rastergrafik
- 6 - Gaming Performance: Supersampling, RT & FG
- 7 - Leistungsaufnahme, Lastspitzen und Netzteilempfehlung
- 8 - Kühler, Temperaturen, Thermografie, Geräuschentwicklung
- 9 - Zusammenfassung und Fazit
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