For once, today’s review is not about superlatives, but about reliability, minimalism and value for money. The T-Create Expert series from Teamgroup is aimed at workstation users who are simply looking for reliable, fast RAM, without any RGB eye candy or gaming touches. Of course, a good portion of performance should not be missing, because computing time is money.
With 2x 24 GB, this is a rather standard kit layout, consisting of single-sided, single-ranked modules, each with 8 ICs with a gross capacity of 24 Gbit and a net capacity of 3 GB. The modules are specified as DDR5-6400 and tCL 32 at 1.35 V, making them one of the most agile you can currently buy with this capacity.
Unboxing and specifications
The T-Create Expert kits are available in almost every conceivable capacity and speed. Our test sample has 2x 24 GB modules with “6400 MHz” and black heat sinks. Teamgroup supplies ready-made profiles in both AMD EXPO and Intel XMP format.
In addition to the two modules, which are held in a transparent plastic frame, there is only one sticker in the scope of delivery – that’s it.
The modules themselves are also kept spartan. The heat sink halves are made from a single aluminium sheet, anodized in black and have a few gold letterings on the front. The bottom corners are rounded. The coolers could hardly be simpler.
On the back there is only the sticker with the product number, serial number and the EXPO/XMP profile. The information on the rank topology with “1Rx8” has also crept in here. Unfortunately, this information cannot be found on the packaging or in the specifications on the manufacturer’s website. With 24 GB capacity, this information can be deduced with great certainty, but there are also other capacities or downbin ICs that could lead to surprises in the rank configuration. As this is also important for compatibility, this information should be made transparent to the customer before purchase.
From above, we can see that the heatsink is perforated in two rows, which should of course help convection and thus heat dissipation. In the middle, the perforation is exposed and a golden T-Create lettering is printed here.
From below, the one-sided placement of the modules is clearly visible, with the rear side filled with a foam placeholder as always. The thermal pad appears to be either two-layered or to consist of two sheets due to the manufacturing process.
From the side, it can be seen that the pad is also cut out rounded at the bottom to match the heatspreader, but does not completely cover the outer memory module.
12 Antworten
Kommentar
Lade neue Kommentare
Veteran
Veteran
Urgestein
Veteran
Veteran
Urgestein
Mitglied
Veteran
Urgestein
Veteran
Urgestein
Veteran
Alle Kommentare lesen unter igor´sLAB Community →