Temperature measurements and forecasts
In a real environment, the MX-7 shows a very balanced and, above all, reproducible temperature behavior, which is consistently reflected in the curves below. The temperature increase with increasing layer thickness remains flat and uniform, which indicates good compaction and stable thermal conduction paths. The MX-7 therefore reliably keeps temperatures low and is among the top pastes tested across the entire measurement range. Compared with the other TIMs in the diagrams, it is clear that the MX-7 is characterized above all by its low sensitivity to bond line thickness. While pastes such as the MX-4 visibly lose temperature after the first few micrometers and the older MX-6 revision rises more steeply, the MX-7 remains close to the high-performance reference pastes across all thicknesses. This is particularly true in the area that is most relevant for real applications. Where coating thicknesses are typically between around 20 and 60 microns, the MX-7 is almost consistently in close proximity to higher-priced or industrially optimized TIMs.
It is noticeable that the MX-7 is clearly ahead of the MX-6 New Formula in this area, even though both pastes have a similar overall performance profile. The MX-7 benefits visibly from its better compression and lower interface content, which is reflected in slightly lower temperatures. It is precisely these differences of a few tenths of a degree that are decisive in practice when modern CPUs push their temperature offsets to the limit and react to every additional degree. The comparison to other pastes with known high or very high performance is also in favor of the MX-7. Products such as TG-04, CTG12 or Duronaut are slightly lower, but the gap remains small and constant. This confirms that although the MX-7 is not an absolute top paste, it achieves a level within the common oxide formulations that is completely sufficient for almost all practical situations. It hardly strains thermal reserves, reacts well to higher contact pressures and shows no weakness when the layer thickness increases slightly due to manufacturing tolerances.
The temperature curve thus fits seamlessly into the picture that can be derived from morphology, tear-off behavior and λeff. The MX-7 works stably, can be pressed well onto thin layers and shows little dependence on unavoidable geometric variations. In real-life applications, this means that it works reliably and predictably both in classic desktop systems and in scenarios with higher thermal loads.
CPUs with headspreader
CPUs without headspreader /Direct Die)
GPUs
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